The IDSPS Industry Advisory Board (IAB) Meeting was convened at IIT Gandhinagar recently, bringing together leading faculty members and industry experts to advance India’s semiconductor ecosystem and reinforce strategic industry–academia collaboration.

The meeting was graced by Prof Rao Tummala, CEO, IDSPS; Prof Rajat Moona, Director, IITGN; Ashok Chandak, President of India Electronics and Semiconductor Association (IESA) and SEMI; Navin Bishnoi of Marvell Technology and Chair, IAB; and Ravi Bhatkal of MacDermid and Vice Chair, IAB. Their presence highlighted the importance of continued collaboration between academia and industry to build a strong and reliable semiconductor value chain in India.

The event opened with an inaugural panel discussion featuring Prof Rao Tummala, Prof Rajat Moona, Ashok Chandak, Navin Bishnoi, and Ravi Bhatkal. The discussion focused on strengthening India’s semiconductor, power electronics, and advanced manufacturing ecosystem through collaborative research, dedicated innovation platforms, and closer engagement between academia, industry, and government.

“Today, we are looking at creating a strong foundation for India’s electronics and semiconductor ecosystem,” said Prof Rajat Moona, Director IITGN. “The idea is to set up dedicated research hubs — one here and another in collaboration with the ministry, which will act as nuclei connecting various professors, institutions, and industry partners. These centres are designed to be industry-oriented, with a focus on solving real problems that matter to the market and the country.”

“Our goal is to become a multiplier — ensuring that knowledge, solutions, and innovation developed here can benefit multiple sectors and stakeholders. We are committed to creating platforms that turn ideas into actionable projects for government implementation. Initiatives in power electronics, semiconductor design, and advanced materials are key to building capabilities, fostering collaboration, and positioning India as a global technology leader,” he added.

Prof Rao Tummala, CEO of IDSPS, highlighted the importance of deeper collaboration between academia, industry, and government to accelerate innovation and technology development.

“Building an integrated ecosystem that connects universities, industry, and government is key for advancing electronics and semiconductor technologies,” he said, adding that dedicated research centres and collaborative programmes will help develop skilled talent, strengthen supply chains, and position India as a global hub for next-generation technology.

Ashok Chandak, President of the India Electronics and Semiconductor Association (IESA) and SEMI, emphasised the growing importance of strengthening the design and manufacturing ecosystem to support industrial growth and economic resilience.

“Strengthening the design-driven manufacturing ecosystem will be crucial for enhancing competitiveness and productivity across industries,” Chandak said during the panel discussion. He also highlighted the need for stronger collaboration between industry, academia, and government to build capabilities, encourage innovation, and respond effectively to evolving global market demands.

The panel also discussed the importance of learning from global research collaboration models such as the Semiconductor Research Corporation (SRC). Participants noted that SRC’s success has been driven by strong collaboration and benchmarking practices. It was suggested that initiatives such as IDSPS should align with existing technology roadmaps, adopt proven intellectual property frameworks, and draw from the best aspects of established global models. Emphasis was also placed on using peer‑reviewed research publications that advance the state of the art as a benchmark for technological progress and innovation.

Following the panel discussion, Prof Rao Tummala presented the vision, strategy, programmes, and future plans of the IDSPS Industry Consortium, outlining the roadmap for strengthening research collaboration and accelerating industry engagement. This was followed by a session on the role of the Industry Advisory Board (IAB) in guiding the consortium’s strategic direction and ensuring alignment with industry priorities.

Over the two-day deliberations, comprehensive discussions were held across the entire semiconductor manufacturing process flow, with particular emphasis on next-generation advanced packaging and integrated power electronics.

In advanced packaging, discussions focused on package design innovation, advanced and sustainable materials, substrate technologies, integrated opto-electronics, heterogeneous integration approaches, and IC- and board-level assembly. Participants examined emerging global trends and explored pathways for India to establish capabilities in high-value segments of the packaging ecosystem.

In the area of integrated power electronics, discussions addressed key aspects such as thermal management solutions, advanced power module design, substrate innovation, high-reliability architectures, and module- and system-level testing frameworks. Emphasis was placed on improving performance efficiency, enhancing durability, and ensuring scalability for automotive, renewable energy, and industrial applications — sectors expected to drive significant semiconductor demand in the coming decade.

IAB members also highlighted the importance of innovation-driven solutions, structured ecosystem development, global partnerships, and capacity building. Strengthening research-to-industry translation, fostering start-up engagement, enabling supply chain localization, and building skilled talent pipelines were identified as essential pillars for sustainable growth. The meeting further reinforced the need for standardized processes and reliability benchmarks aligned with international best practices.

A key outcome of the meeting was the constructive discussion surrounding the proposed Advanced Packaging Pilot Line at IIT Gandhinagar and the Integrated Power Electronics Pilot Line at IIT Bhubaneswar. These pilot lines are envisioned as critical infrastructure platforms to support prototyping, industry collaboration, technology validation, and workforce development. The initiative aims to bridge the gap between laboratory-scale research and industrial-scale deployment, thereby strengthening India’s position in the global semiconductor landscape.

Prof Shreepad Karmalkar, Director, IIT Bhubaneswar highlighted the importance of industry-academia collaboration in driving technological innovation. Reflecting on past initiatives, he emphasized the need for structured engagement with industry partners and advanced technology programs. He expressed a strong commitment to continuing these collaborative efforts, exploring next-generation technologies, and building frameworks to support future innovation, workforce development, and potential foreign direct investment (FDI) opportunities.

Over the two-day deliberations, comprehensive discussions were held across the entire semiconductor manufacturing process flow, with particular emphasis on next-generation advanced packaging and integrated power electronics. In advanced packaging, detailed conversations were focused on package design innovation, advanced and sustainable materials, substrate technologies, integrated opto-electronics, heterogeneous integration approaches, and IC- and board-level assembly. Participants examined emerging global trends and explored pathways for India to establish capabilities in high-value segments of the packaging ecosystem.

The meeting concluded with a shared commitment to advancing coordinated efforts across academia, industry, and policy stakeholders. IDSPS was reaffirmed as a strategic enabler supporting national semiconductor initiatives and contributing to India’s long-term vision of technological self-reliance, innovation leadership, and a globally competitive semiconductor manufacturing ecosystem.

SM/GP

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