Ministry of Electronics & IT
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Odisha to break ground on India’s First Advanced 3D Chip Packaging Unit


The Advanced 3D Chip Packaging Unit positions Odisha in the top-tier of global semiconductor packaging

Posted On: 18 APR 2026 4:14PM by PIB Bhubaneswar

In a landmark step towards positioning India as a global hub for advanced semiconductor manufacturing, Odisha is set to host the ground-breaking ceremony of Heterogenous Integration Packaging Solutions (3D Glass Solutions), India’s first Advanced  Glass Semiconductor Packaging Unit on April 19, 2026, in Bhubaneswar.

The Chief Minister of Odisha, Shri Mohan Charan Majhi will grace the ceremony, in the august presence of the Union Minister for Railways, Information & Broadcasting and Electronics & Information Technology, Shri Ashwini Vaishnaw and the Minister for Electronics & IT, Government of Odisha.  Dr Mukesh Mahaling. The event will also witness participation from senior Government officials, global industry leaders, investors, and academia.

This pioneering project marks the arrival of the world’s most advanced chip packaging technology in India, firmly placing Odisha at the forefront of next-generation semiconductor innovation.

Key Highlights of the Project:

First in India: Establishment of the country’s first Glass substrate based Advanced Semiconductor Packaging Unit in Odisha

Cutting-edge Technology: Introduction of  advanced 3D Heterogeneous Integration modules

Rapid Progress: Groundbreaking within months of approval by the Union Cabinet, reflecting fast-track implementation

Strategic Investment: Project outlay of approximately ₹1,943 crore

Employment Generation: Creation of around 2,500 direct and indirect jobs

High Capacity: Annual production capacity of 50 million assembled units

Critical Applications: Chips to serve key sectors including aerospace, defence, artificial intelligence, 5G technologies and Data Centres.

This milestone further strengthens Odisha’s semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on Glass Substrates.

The initiative underscores the Government of Odisha’s commitment to fostering high-tech industries, attracting global investments, and creating a robust innovation-driven economy aligned with the vision of Atmanirbhar Bharat.

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Swadhin Shakti Prasad/Manoj Kumar Jali


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Read this release in: Odia